PLASMA ENHANCED ALD SYSTEM
Wafer-level package & backside wafer marking perfectly without damaging the dies.
– Applicable to 8˝ & 12˝ wafers
– Configuration : wafer alignment, vision, laser, picker, SCARA Robot (dual hand / vacuum type)
– Marking Accuracy : 5㎛
– Vision for high quality & precise inspection recognition of waver position information & marking inspection