Wafer-level package & backside wafer marking perfectly without damaging the dies.

– Applicable to 8˝ & 12˝ wafers

– Configuration : wafer alignment, vision, laser, picker, SCARA Robot (dual hand / vacuum type)

– Marking Accuracy : 5㎛

– Vision for high quality & precise inspection recognition of waver position information & marking inspection

POLYIMIDE OVEN

Wafer-level package & backside wafer marking perfectly without damaging the dies.

– Applicable to 8˝ & 12˝ wafers

– Configuration : wafer alignment, vision, laser, picker, SCARA Robot (dual hand / vacuum type)

– Marking Accuracy : 5㎛

– Vision for high quality & precise inspection recognition of waver position information & marking inspection

TECHNICAL DOCUMENTS

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