RapiTrim-C-UV (355 nm)
RapiTrim-C with UV (355 nm) Laser.
The RapiTrim-C-UV model is designed for multi-purpose and specialty applications. These include the trimming of thick- and thin-film resistors with narrow kerf, or applications with additional processing capability for materials such as copper, polyimide, ceramic (green tape, stackups or fired), FR4 and others.
Advanced laser and beam control, combined with available proprietary high-speed flying probe technology allows the RapiTrim systems to outperform older technology in both high volume production as well as low-volume, high-mix operations. Circuits can be as large as the substrate itself, and probing of dense designs is effortless, previously requiring multiple passes with multiple probe cards.
System Features Include:
- Intuitive Graphical User Interface with ProSys operating software
- Advanced Beam Positioning and Laser Pulse Control provide high throughput, accuracy, and process stability
- High Accuracy, High Bandwidth Real-Time Measurement system
- Auto-Calibration functions ensure repeatable quality
- Extensive System Diagnostics continuously monitor all critical components and machine performance
- Sealed Beam Delivery protects optics from process debris, extending component lifetimes
- Touchscreen operation (full HD size)
