SH-5300 

The SH-5300 is MCT’s 5th generation strip test handler. It is a versatile, flexible, high throughput, highly parallel test handling system designed to handle and test integrated circuit devices at various controlled temperatures, from -55°C to +160°C.  The SH-5300 is the newest version of the production proven SH-5000 tri-temp platform
that has been shipping since 2008. The main difference is that the SH-5300 has had some parts re-designed so that it can handle the new extremely high-density lead frames (XDLF) that are now being produced. These new XDLF lead frames are 100mm x 300mm in size and are being rapidly introduced to help drive down assembly costs.
The older SH-5000 can handle lead frames with a maximum size of 100mm x 275mm and will continue to be available for sale until late 2015. With the exception of the maximum lead frame size, everything contained in this
document applies to both the SH-5300 and the SH-5000.

The SH-5300 is highly flexible and is capable of handling virtually any leaded package in strip format (see Figure 2.0), including SOIC, TSOP, TSSOP, MSOP, QFP, TQFP, SOT and pocket- molded QFN packages. It is also capable of handling Chip Scale Packages (CSP’s), Chip Array, Ball Grid Array, μBGA, and other over-molded devices
on laminated panels or strips. The SH-5300 is also well suited for handling blockmolded QFN and DFN style packages that must be tested at temperature.