Reflow Ovens – Trident Technologies

Reflow ovens - Trident Technologies

Reflow ovens we carry

What is reflow oven?

A reflow oven is a machine that is mainly used for the reflow soldering of surface-mount electronic components to printed circuit boards (PCBs).

In commercial high-volume application, reflow ovens have the shape of a lengthy tunnel with a conveyor belt that transports PCBs.

Commercial conveyorised reflow ovens include numerous separately heated zones that may be individually temperature adjusted. PCBs are treated at a regulated rate as they pass through the oven and each zone.

To obtain a given time and temperature profile, technicians modify the conveyor speed and zone temperatures. The profile used may change based on the needs of the PCBs being processed at the moment.

Types of reflow ovens

Convection and infrared ovens

The heat source in infrared reflow ovens is typically ceramic infrared heaters above and below the conveyor, which deliver heat to the PCBs by radiation.

Convection ovens heat air in chambers, which is then used to transmit heat to PCBs by convection and conduction.

They may be fan-assisted in order to adjust airflow within the oven. Because PCBs and components differ in infrared absorptance, indirect heating using air allows for more precise temperature control than direct heating with infrared radiation.

Ovens that employ both infrared radiative heating and convection heating are referred to as ‘infrared convection’ ovens.

Some ovens are made to reflow PCBs in an oxygen-free environment. Nitrogen (N2) is a popular gas for this purpose. This reduces oxidation on the soldering surfaces.

It takes a few minutes for the nitrogen reflow oven to lower the oxygen concentration within the chamber to acceptable limits. As a result, nitrogen ovens often keep nitrogen infusion running at all times, which reduces failure rates.

Vapour phase oven

The heating of the PCBs is provided by thermal energy generated by the phase transition of a heat transfer liquid (e. g. PFPE) condensing on the PCBs. The liquid used is chosen with the proper boiling point in mind for the solder alloy to be reflowed in mind.

The following are some advantages of vapour phase soldering:

  • Because of the high heat transfer coefficient of vapour phase medium, it has a high energy efficiency.
  • Soldering is an oxygen-free process. There is no need for any protective gas (e.g., nitrogen), and there is no risk of assembly overheating.
  • The boiling point of the medium limits the highest temperature that assembly can attain.

This is sometimes referred to as condensation soldering.

Thermal profiling

Thermal profiling is the practice of measuring many places on a circuit board to detect the thermal excursion that occurs during the soldering process.

SPC (statistical process control) in the electronics manufacturing business helps assess if the process is under control, as measured against the reflow parameters established by soldering technologies and component requirements.

Get quote for reflow ovens

Need reflow oven equipment for your operations? Drop us an enquiry with your requirements and we’ll get back to you with recommended options and cost estimates. Contact us now.