MRO 160 Batch Reflow Oven

Assembly

The Convection Reflow Solder System has a drawer unit for accepting Printed Circuit Boards on individually adjustable supports which are held in place by magnetic feet.The low mass and small contact area of the supports contribute to uniform heating of PCBs. A microprocessor fully controls the heating process and ensures reliable and reproducible results. Programming and operation is carried out from the clearly arranged keyboard. All data entered by the user and essential information for the operation of each process is shown on the two line LCD display.

Ease of operating
Operating is made quick and easy by a menu system. Each temperature profile has a four digit number allocated to it which is used for storage and retrieval. There are 9999 memory locations available for saving profile parameters.
As soon as the four parameters (pre-heat temperature and time and reflow temperature and time) for a heating cycle are defined, the process can be started.