The LM901 is the entry model of our modular-built systems. Besides the LM900 functionality, it can be extended with axis brakes, dispensers and optical support systems for component placing. The system supports the whole dispensing-/Pick&Place – process, from supplying the solder paste or glue to placing standard, Fine-Pitch or BGA components. To ensure high flexibility, the LM901 can be upgraded to a semi-automatic manipulator.
The unrivalled smooth-running guide of the mounting head helps to place the SMDs accurately. When the pipette
comes into contact with the components, the vacuum automatically switches itself on and when placing them, it
switches off. The adjustable vacuum reactivation alleviates and accelerates the extraction of components, especially
from bulk goods containers and when mounting Melfs.
Integrated dispensing unit
There are two different dispenser systems available to integrate into all manipulators.
A simple time-pressure dispenser system and a microprocessor-controlled dispenser system, which measures the
influencing factors such as temperature, the fill level of the syringe and the viscosity of the medium. By recording the
additional factors, reproducible results are achieved even in the case of small output quantities. Besides soldering paste and adhesive, other media can also be dispensed. Both dispenser systems automatically switch on the dispensing process as soon as the slanted dispenser needle comes into contact with the PCB. The vertical syringe ensures that the dispenser needle does not slip sideways when touching the PCB. Three programmable dispensing times are available for the dispensing on different pad sizes. They can be preset in the menu as required.
- Placement rate from an experienced operator is 300-600 SMDs/hour.
- Dimensions: 600 mm x 600 mm x 345 mm
- max. throat: 600 mm x 1100 mm x 345 mm
- max. PCB size: 440 mm x 245 mm
- max. placement area: 350 mm x 245 mm
- max. lift of assembling head: 26 mm